Intel hd graphics 530 đánh giá


Hãng Intel HD 530 Graphics – Features

All of Intel’s mainstream desktop processors have sầu included integrated graphics for several years now and Skylake is no different.

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The exact configuration will vary from chip khổng lồ chip, with some sporting the new higher power graphics with dedicated L4 caches like on some recent Broadwell chips – ikhuyến mãi for powerful compact computers where a graphics thẻ isn’t an option.

However, most will sport a variation on the Hãng sản xuất Intel HD Graphics 530 that is included in the 6700K and 6600K. Not that we know a great giảm giá khuyến mãi about these GPUs as Hãng sản xuất Intel is yet lớn reveal many details regarding its inner workings.

However, we can work a few things out for ourselves. For instance we know it runs at 350MHz and addresses 1067MHz of RAM via a 128-bit bus producing 34.1GB/s of memory bandwidth. It’s also rated to support DirectX 11.2 – notably, not DirectX 12 – and features 48 unified shaders, 8 ROPs và 16 TMUs producing a pixel fillrate of 2.8GPixel/s và texture fillrate of 5.6GTexel/s.

This compares to fillrates of 0.8GPixel/s và 1.6GTexel/s for the Hãng sản xuất Intel HD Graphics 4600 as used in the bộ vi xử lý Core i7-4770K/4790K and Core i5-4670K/4690K. That older thiết kế also has just over 20GB/s memory bandwidth. This clearly marks the HD Graphics 530 out as a significant tăng cấp, though as ever it’s still a far cry from the performance you’d get with a dedicated graphics thẻ.

Intel Z170 Chipset – Features

As well as a processor thiết kế, Skylake ushers in a new chipphối và CPU socket too. So, yes, you will need lớn nâng cấp your motherboard lớn get one of these CPUs… well, to lớn get one working at any rate.

The only chipmix to lớn tư vấn Skylake that has been announced so far is Z170. As well as supporting the new LGA1551 socket into which the processors will sit, it brings several other upgrades with it over Haswell/Broadwell’s Z97.

Primary among mỏi these is the addition of four PCIe 3.0 lanes, making for a total of đôi mươi.

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This greatly opens up the potential throughput of the system for things likes PCIe storage, such as the new Intel SSD 750 series, & Thunderbolt without impacting on the performance of graphics cards.


There’s also a boost in USB 3.0 ports, from six to ten, & in total USB ports (3.0 và 2.0) from 10 to 14. Networking support has also improved, with Z170 mix to be available with the new Snow Peak (WiFi & Bluetooth) chipsets.

Thunderbolt 3.0 also debuts with Z170. This is essentially an extension to USB 3.1 Type-C, with it using the same socket. However, it will use a different (though USB-compatible) cable that allows it to increase throughput from 10Gbps to lớn 40Gbps as well as add new features lượt thích the ability to lớn use it to attach graphics cards.

Also new with this chipmix, when combined with the 6700K and 6600K, are more granular overclocking options. Instead of the ratio based Base-Clock setting of previous setups, the Base Clock can now be set at any cấp độ with increments of as little as 1MHz. Memory frequency can also be massively boosted up to 4133MT/s while DDR granularity steps reduce from 200/266MHz khổng lồ 100/133MHz.

Chip Design

When it comes lớn the physical kiến thiết of the new Skylake chips – or at least the 6700K và 6600K – there’s not a huge amount to lớn say about them as they look & persize largely like most recent previous Hãng sản xuất Intel CPUs.

The most obvious feature of them as compared with AMD’s processors, or indeed much older Hãng Intel chips, is that they don’t incorporate any contact pins but instead have flat gold contacts. Instead the cost of manufacturing all the tiny pins required is passed onkhổng lồ the motherboard manufacturers, as these are all in the mounting socket.


A greater number of tiny resistors và capacitors on the underside of the package indicates extra effort to deliver the smoothest possible power lớn the chip, for better overclocking. This was a noticeable upgrade when comparing the high-end Haswell-refresh chips – the i7-4790K and i5-4690K – to lớn the lower cấp độ parts so we expect more mainstream Skylake processors to lớn have fewer components on the underside.

On the topside, the metal heat spreader is glued in place over the silinhỏ chip itself, with a thermal interface material (TIM) used to lớn marry the two together, carrying heat away from the chip. This paste is likely the same improved formula that was used in the Haswell-refresh chips, after Hãng sản xuất Intel received multiple complaints about the formula used on the original Haswell chips – so poor was the material và the way it was applied that users took khổng lồ removing the heat spreader & applying their own paste.

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